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GIGABYTE B760M DS3H DDR4

 45,999

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GIGABYTE B760M DS3H DDR4

GIGABYTE B760M DS3H DDR4

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GIGABYTE B760M DS3H DDR4

  • Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors
  • Unparalleled Performance:Hybrid 6+2+1 Phases Digital VRM Solution
  • Dual Channel DDR4:4*DIMMs XMP Memory Module Support
  • Next Generation Storage:2*PCIe 4.0 x4 M.2 Connectors
  • M.2 Thermal Guard:To Ensure M.2 SSD Performance
  • EZ-Latch:PCIe 4.0×16 Slot with Quick Release Design
  • Fast Networks:2.5GbE LAN
  • Extended Connectivity:Rear USB-C® 10Gb/s, DP, HDMI
  • Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card

GIGABYTE B760M DS3H DDR4

  • CPU
    1. LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors
    2. L3 cache varies with CPU

    (Please refer “CPU Support List” for more information.)

  • Chipset
    1. Intel® B760 Express Chipset
  • Memory
    1. Support for DDR4 5333(O.C.)/ 5133(O.C.)/ 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.)/ 4133(O.C.)/ 4000(O.C.)/ 3866(O.C.)/ 3800(O.C.)/ 3733(O.C.)/ 3666(O.C.)/ 3600(O.C.)/ 3466(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3300(O.C.)/ 3200/ 3000/ 2933/ 2666/ 2400/ 2133 MT/s memory modules
    2. 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
    3. Dual channel memory architecture
    4. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
    5. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
    6. Support for Extreme Memory Profile (XMP) memory modules

    (Please refer “Memory Support List” for more information.)

  • Onboard Graphics

    Integrated Graphics Processor-Intel® HD Graphics support:

    1. 1 x D-Sub port, supporting a maximum resolution of 1920×1200@60 Hz
    2. 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz
      * Support for HDMI 2.0 version and HDCP 2.3.
    3. 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
      * Support for DisplayPort 1.2 version and HDCP 2.3
    4. 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
      * Support for DisplayPort 1.2 version.

    (Graphics specifications may vary depending on CPU support.)

    Support for up to quad-display at the same time

    GIGABYTE B760M DS3H DDR4
  • Audio
    1. Realtek® Audio CODEC
    2. High Definition Audio
    3. 2/4/5.1/7.1-channel
      * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.
    4. Support for S/PDIF Out
  • LAN
    1. Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
  • Expansion Slots

    CPU:

    1. 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16

    Chipset:

    1. 2 x PCI Express x1 slots, supporting PCIe 3.0 and running at x1
  • Storage Interface

    CPU:

    1. 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)

    Chipset:

    1. 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
    2. 4 x SATA 6Gb/s connectors

    RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices

  • USB

    Chipset:

    1. 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2 support
    2. 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
    3. 2 x USB 2.0/1.1 ports on the back panel

    Chipset+2 USB 2.0 Hubs:

    1. 4 x USB 2.0/1.1 ports available through the internal USB headers
  • Internal I/O Connectors
    1. 1 x 24-pin ATX main power connector
    2. 1 x 8-pin ATX 12V power connector
    3. 1 x CPU fan header
    4. 3 x system fan headers
    5. 1 x addressable LED strip header
    6. 1 x RGB LED strip header
    7. 2 x M.2 Socket 3 connectors
    8. 4 x SATA 6Gb/s connectors
    9. 1 x front panel header
    10. 1 x front panel audio header
    11. 1 x USB 3.2 Gen 1 header
    12. 2 x USB 2.0/1.1 headers
    13. 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
    14. 1 x serial port header
    15. 1 x parallel port header
    16. 1 x S/PDIF Out header
    17. 1 x Q-Flash Plus button
    18. 1 x reset button
    19. 1 x reset jumper
    20. 1 x Clear CMOS jumper

    GIGABYTE B760M DS3H DDR4

    GIGABYTE B760M DS3H DDR4

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