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B560M DS3H V2 GIGABYTE
B560M DS3H V2 GIGABYTE
YOU CAN BUY IT HERE
OR OUR OTHER WEBSITE HERE
B560M DS3H V2 GIGABYTE COMES WITH FOLLOWING SPECS AND FEATURES
B560M DS3H V2 GIGABYTE
- Supports 11th and 10th Gen Intel® Core™ Series Processors
- Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
- Direct 6+2 Phases Digital VRM Solution with Low RDS(on) MOSFETs
- Dual Ultra-Fast NVMe PCIe 4.0/3.0* x4 M.2
- GIGABYTE Exclusive 8118 Gaming LAN with Bandwidth Management
- USB 3.2 Gen1 Type-C® for Fast and Versatile Connections
- High Quality Audio Capacitors and Audio Noise Guard with LED Trace Path Lighting
- RGB FUSION 2.0 Supports Addressable LED & RGB LED Strips
- Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP
- Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
- LGA1200 package:B560M DS3H V2 GIGABYTE
- 11th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors
- 10th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors / Intel® Core™ i3 processors/ Intel® Pentium® processors / Intel® Celeron® processors*
* Limited to processors with 4 MB Intel® Smart Cache, Intel® Celeron® G5xx5 family. - L3 cache varies with CPU
(Please refer to “CPU Support List” for more information.)
- Chipset
- Intel® B560 Express Chipset
- B560M DS3H V2 GIGABYTE
- Memory
- 11th Generation Intel® Core™ i9/i7/i5 processors:
Support for DDR4 5333(O.C.) / DDR4 5133(O.C.) / DDR4 5000(O.C.) / 4933(O.C.) / 4800(O.C.) / 4700(O.C.) / 4600(O.C.) / 4500(O.C.) / 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz - 10th Generation Intel® Core™ i9/i7 processors:
Support for DDR4 2933/2666/2400/2133 MHz memory modules - 10th Generation Intel® Core™ i5/i3/Pentium®/Celeron® processors:
Support for DDR4 2666/2400/2133 MHz memory modules - 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
- Dual channel memory architecture
- Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
- Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
- Support for Extreme Memory Profile (XMP) memory modules
(Go to GIGABYTE’s website for the latest supported memory speeds and memory modules.)
- 11th Generation Intel® Core™ i9/i7/i5 processors:
- Onboard Graphics
Integrated Graphics Processor-Intel® HD Graphics support:
- 1 x DVI-D port, supporting a maximum resolution of 1920×1200@60 Hz
* The DVI-D port does not support D-Sub connection by adapter. - 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
* Support for DisplayPort 1.2 version and HDCP 2.3 - 1 x HDMI port, supporting a maximum resolution of 4096×2160@30 Hz
* Support for HDMI 1.4 version and HDCP 2.3.
- 1 x DVI-D port, supporting a maximum resolution of 1920×1200@60 Hz
(Graphics specifications may vary depending on CPU support.)
Support for up to 3 displays at the same time
- AudioB560M DS3H V2 GIGABYTE
- Realtek® Audio CODEC
- High Definition Audio
- 2/4/5.1/7.1-channel
* To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first.
- LANB560M DS3H V2 GIGABYTE
- Realtek® GbE LAN chip (1 Gbps/100 Mbps)
- Expansion SlotsB560M DS3H V2 GIGABYTE
- 1 x PCI Express x16 slot, running at x16
(The PCIEX16 slot conforms to PCI Express 4.0 standard.)(Note) - 2 x PCI Express x1 slots
(The PCIEX1 slot conforms to PCI Express 3.0 standard.)
(Note) Supported by 11th Generation processors only.
- 1 x PCI Express x16 slot, running at x16
- Storage InterfaceCPU:B560M DS3H V2 GIGABYTE
- 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_CPU)(Note)
Chipset:
B560M DS3H V2 GIGABYTE- 1 x M.2 connector (Socket 3, M key, type 2260/2280 SATA and PCIe 3.0 x4/ x2 SSD support) (M2A_SB)
- 6 x SATA 6Gb/s connectors
* Refer to “1-7 Internal Connectors,” for the installation notices for the M.2 and SATA connectors.
Intel® Optane™ Memory Ready
* System acceleration with Intel® Optane™ Memory can only be enabled on the M2P_CPU connector and with an 11th Generation Intel® processor installed.(Note) Supported by 11th Generation processors only.
- USB
Chipset:
- 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 1 support
- 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
- 4 x USB 2.0/1.1 ports (2 ports on the back panel, 2 ports available through the internal USB header)
Chipset+USB 2.0 Hub:
- 2 x USB 2.0/1.1 ports available through the internal USB headers
- Internal I/O Connectors
- 1 x 24-pin ATX main power connector
- 1 x 8-pin ATX 12V power connector
- 1 x CPU fan header
- 3 x system fan headers
- 1 x addressable LED strip header
- 1 x RGB LED strip header
- 6 x SATA 6Gb/s connectors
- 2 x M.2 Socket 3 connectors
- 1 x front panel header
- 1 x front panel audio header
- 1 x USB 3.2 Gen 1 header
- 2 x USB 2.0/1.1 headers
- 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
- 1 x serial port header
- 1 x parallel port header
- 1 x Clear CMOS jumper
- 1 x Q-Flash Plus button
*All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W.
- Back Panel Connectors
- 2 x USB 2.0/1.1 ports
- 1 x PS/2 keyboard/mouse port
- 1 x DVI-D port
- 1 x DisplayPort
- 1 x HDMI port
- 3 x USB 3.2 Gen 1 ports
- 1 x USB Type-C® port, with USB 3.2 Gen 1 support
- 1 x RJ-45 port
- 3 x audio jacks
- I/O Controller
- iTE® I/O Controller Chip
- H/W Monitoring
- Voltage detection
- Temperature detection
- Fan speed detection
- Fan fail warning
- Fan speed control
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